Futuristic hybrid thermoelectric devices and designs and methods of using same

ABSTRACT

This patent incorporates several new hybrid thermoelectric element and thermoelectric device designs that utilize additional electronic materials to enhance the flow of charges in the thermoelectric elements without changing thermoelectric nature of the thermoelectric material used. The thermoelectric device efficiency is thereby increased and cost and size are lowered. Thermoelectric conversion devices using the new design criteria have demonstrated comparative higher performance than current commercially available standard design thermoelectric conversion devices.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority of U.S. Provisional Patent ApplicationNo. 61/659,367, entitled “Futuristic Thermoelectric Devices and Designsand Methods of Using Same” filed Jun. 13, 2012.

BACKGROUND Summary

Design of thermoelectric conversion devices, for power generation orcooling, of the present invention include(s) new hybrid element anddevice configurations and combinations that utilize, in addition tothermoelectric crystalline or amorphous materials, additionalelectrically and/or thermally conductive and/or insulator electronicmaterials to augment, enhance and boost the performance ofthermoelectric elements and the thermoelectric devices thereof. Newdesign criteria are also presented for multi-stage thermoelectricdevices, layout and connection techniques, as well as for new heattransfer/electrical connectivity plates to lower device footprint andincrease the output of the resulting thermoelectric device(s).

BRIEF DESCRIPTION OF THE DRAWINGS

The features, aspects, and advantages of the designs of this inventionwill become more thoroughly apparent from the following detaileddescription, appended claims, and accompanying drawings in which theproposed new designs for hybrid thermoelectric devices whereby thethermoelectric elements include the use of electrically and/or thermallyconductive and/or insulator electronic materials (hereinafter referredto as “add-on electronic materials”), heat transfer/electricalconnectivity plates, interconnections for use in thermoelectric devicesare depicted.

FIG. 1 is a side view of n-type/p-type thermoelectric elements thatillustrates the layout of thermoelectric elements in current typicalcommercially available thermoelectric conversion devices.

FIG. 2 illustrates a basic thermoelectric pair of elements with add-onelectronic material(s) attached between two thermoelectric pieces alongthe flow of charges of each thermoelectric element.

FIG. 3 illustrates a thermoelectric device with both elements having abasic low-to-high area concept with inverted thermoelectric elements toimprove performance and reduce footprint of the thermoelectric device.Add-on electronic material(s) are not depicted but are easilyincorporated.

FIG. 4 illustrates a thermoelectric device with both elements having abasic low-to-high area concept with inverted irregular shapedthermoelectric elements to improve performance and reduce footprint ofthe thermoelectric device.

FIG. 5 illustrates a basic thermoelectric pair of elements with add-onelectronic material(s) attached along the partial common face betweentwo thermoelectric pieces along the flow of charges of eachthermoelectric element.

FIG. 6 illustrates a basic thermoelectric pair of elements with add-onelectronic material(s) attached along the entire common face between twothermoelectric pieces completely along the flow of charges of eachthermoelectric element.

FIG. 7 illustrates a pair of thermoelectric pieces of a thermoelectricelement whereby the add-electronic material(s) extend out from theircommon face along the flow of charges to make thermal and/or electricalcontact with the heat transfer/electrical connectivity plate(s).

FIG. 8 illustrates add-on electronic material(s) embedded along the flowof charges in a thermoelectric element and connecting with adjacentelement(s) as well as the heat transfer/connectivity plates).

FIG. 9 illustrates add-on electronic material(s) with attached wing(s)embedded in the thermoelectric material of a thermoelectric element.

FIG. 10 illustrates add-on material(s) with cut out wing(s) embedded inthe thermoelectric material of a thermoelectric element.

FIG. 11 illustrates two thermoelectric pieces in a thermoelectricelement with add-electronic material(s) including wings attached totheir partial common face along the flow of charges of thethermoelectric pieces.

FIG. 12 a illustrates two thermoelectric pieces in a thermoelectricelement with add-electronic material(s), including wings, partiallyattached along their entire common face and the add-on electronicmaterial(s) extend from the thermoelectric pieces to make thermalcontact with the heat transfer/electrical connectivity plate(s) as wellas electrical contact with adjacent dissimilar thermoelectric elements.

FIG. 12 b illustrates two thermoelectric pieces in a thermoelectricelement fully encased with add-electronic material(s), including wings,partially attached along their entire common face and the add-onelectronic material(s) extend from the thermoelectric pieces to makethermal contact with the heat transfer/electrical connectivity plate(s)as well as electrical contact with adjacent dissimilar thermoelectricelements.

FIG. 13 illustrates a pair of thermoelectric pieces of differing heightin a thermoelectric element with add-electronic material(s) partiallyattached on their common face along the flow of charges and the add-onelectronic material(s) extend out from the bottom and top of thethermoelectric pieces to make thermal contact with the heattransfer/electrical connectivity plate(s) as well as electrical contactwith adjacent dissimilar thermoelectric elements.

FIG. 14 illustrates two thermoelectric pieces in a thermoelectricelement with add-on electronic material(s) attached along the flow ofcharges at the common face of the thermoelectric pieces as well as wingsat the top and bottom of the thermoelectric pieces

FIG. 15 illustrates a channel-shaped heat transfer/electricalconnectivity plate with multiple thermoelectric elements attached to theplate for thermoelectric device footprint reduction.

FIG. 16 illustrates an open-top thermoelectric element design to enhancethermoelectric device performance in airflow environments as well asallow additional electrical wire winding in the thermoelectric device.

FIG. 17 illustrates a thermoelectric device whereby one of thethermoelectric element(s) is/are, say, of only n-type (or p-type)thermoelectric crystalline material with cutouts at top and bottom asdepicted, and the second thermoelectric element(s) comprise(s) of add-onelectronic material(s) with corresponding p-type (or n-type)thermoelectric conductive material that connects to the top and bottomof the respective adjacent first thermoelectric elements; thethermoelectric conductive material of the add-on electronic material isalso designed to make thermal contact(s) by a spring-type design withthe heat transfer/electrical conductivity plate(s).

FIG. 18 illustrates the new multi-stage thermoelectric device withoptional shelves to hold the thermoelectric elements.

FIG. 19 illustrates a thermoelectric segment type device withthermoelectric elements attached to one face of both the hot and coldheat transfer/electrical conductivity plates.

FIG. 20 illustrates a thermoelectric segment with thermoelectricelements attached to both faces of, say, the hot (or cold) heattransfer/electrical connectivity plate and no thermoelectric elementsattached to the cold (or hot) heat transfer/electrical plate.

FIG. 21 depicts a multi-sided (hexagonal) post to which thermoelectricsegments can be attached for the multi-stage thermoelectric device toproduce denser population of thermoelectric elements in the multi-stagethermoelectric device.

FIG. 22 depicts a typical new multistage thermoelectric prepared fromthermoelectric segments connected together with a multi-piece heattransfer/electrical conductivity plate system and optional bench(es) forthermoelectric element(s) laydown. Accordingly, multi-stagethermoelectric devices of any size and/or power output can be readilyfabricated from off-the-shelf parts.

DETAILED DESCRIPTION

The conversion efficiency of heat to useful energy is an on-goingchallenge for the energy industry. Current commercially availablethermoelectric conversion devices, for cooling and power generation, arefabricated from regular-shaped (rectangular, cube, cylindrical, etc.)thermoelectric elements and produce relatively low efficiency heatconversion when compared to other renewable energy conversiontechnologies such as photovoltaic and wind power.

Thermoelectric conversion devices have made incremental gains in deviceefficiency over the past decade mainly due to continued development ofmany new expensive thermoelectric materials with higher ZT (athermoelectric figure of merit). Utilizing the new expensive materialsno doubt yields slightly better efficiency for the thermoelectricdevices but cost makes them prohibitive for commercial use, and they arenot yet competitively efficient to other renewable energy conversiontechnologies, such as photovoltaic.

Other types of thermoelectric conversion devices are also fabricatedusing other techniques including vapor deposition, thin-film, design/layout on an electronic material wafer, segmented design, nanomaterials,nanotube devices, etc., that also incrementally help in surmounting thethermoelectric efficiency barrier; however, the fabrication costs toproduce them still remain prohibitively high.

The basic premise of the workings of a thermoelectric device is that thetemperature gradient/difference from hot side of a thermoelectricelement pair to the cold side of element pair determines the voltageacross the device and hence the flow of charges and efficiency rating.Therefore, tremendous effort continues to be also expended in thedevelopment of heat sink/cooling assemblies that rapidly remove the heatfrom the cold side of the element as well as new thermoelectricmaterials that provide more favorable thermoelectric output properties.

Commercially available conventional thermoelectric conversion devicesrequire an n-type thermoelectric element as well as a p-typethermoelectric element, both fabricated from standard relativelyinexpensive bulk materials, which are interconnected. FIG. 1 providesthe general layout of a typical commercially available thermoelectricdevice. N-type and p-type Bismuth Telluride [(Bi Sb)₂Te₃] thermoelectricelements, mostly rectangular in shape, i.e., the cross-sectional area isconstant along the vertical axis or path of heat flow, are sandwichedbetween two high thermal conductivity alumina substrates. Withalternating bottom interconnects (1) and top interconnects (2), then-type and p-type elements are connected sequentially in series. For thedrawings of this patent, the heat flow is from the bottom to the top,making all thermoelectric elements thermally in parallel. In coolingmode, an externally applied current forces the heat to flow from thebottom to the top. In power generation mode, heat flowing from thebottom to the top drives a current through an external load.

The basic premise of this patent is to utilize standard commerciallyavailable, inexpensive thermoelectric crystalline or amorphous materialelement(s), regular or irregular shaped (6), and improve the performanceof same using new and unique design criteria combined with other add-onelectronic materials to achieve power outputs very similar to thethermoelectric devices made from expensive, high-ZT materials.

The flow of charges in the thermoelectric materials is currently impededby the limitations of the materials or the ZT factor of the specificthermoelectric material. Highly expensive R & D is ongoing to find athermoelectric material with a high(er) ZT factor. However, one commonfactor is always found lacking, i.e., creative design to inexpensivelysolve and overcome this important issue.

This patent incorporates new designs of hybrid thermoelectric elementsusing add-on electronic material(s), new layout and connectiontechniques as well as new heat transfer/electrical connectivity platesto increase the output of the resulting thermoelectric device(s). Thecombinations of the aforementioned with new interconnections cause aturbo-charging effect on the thermoelectric element(s) by expediting andimproving the flow of charges through each thermoelectric elementwithout compromising the thermoelectric nature of the thermoelectricmaterial. This enhances circuit performance of the thermoelectricelement pairs and ultimately produces higher output efficiency of thethermoelectric conversion device.

The add-on electronic material(s) are comprised of metal, non-metal,semiconductor, superconductor, ceramic, plastic, resin, adhesive orsimilar conductor and/or insulator material(s) and/or combination(s) ofthe aforementioned material(s)

During testing of various new designs of thermoelectric elements, it wasfound that by connecting/attaching a conductive strip between twohalf-sized thermoelectric pieces, along the direction of the flow ofcharges (FIG. 2), thermoelectric pairs of this design producedapproximately 2× the output power when compared to a thermoelectric paircomprising standard rectangular full-size thermoelectric elements. Thiswas repeated several times with very similar results. It was therebyrealized that the thermoelectric materials can be made to perform betterby inexpensively introducing localized and simple specially designedadd-on electronic materials to increase the flow of charges within thethermoelectric element(s).

Several criteria are presented below for the hybrid thermoelectricelements with the add-on electronic material(s); using one or more ofthese criteria boosts the flow of charges in the thermoelectricmaterials/elements:

-   -   External Attachment: add-on electronic material(s) is/are        attached between (3) or on the side(s) (8) (16) similar (n-type        or p-type) thermoelectric crystalline or amorphous pieces along        the flow of charges on their common face to form a        thermoelectric element (FIGS. 5-14).    -   Internal Placement: the add-on electronic material(s) may be        placed internal to a thermoelectric piece along the flow of        charges using a extrusion, pultrusion or molding process (FIG.        9). A good example is electrical wire being extruded with the        thermoelectric material.    -   Surface Preparation: when applied to the add-on electronic        material(s) will assist to produce better electrical or        insulator bonding at their respective contact surface(s) with        the thermoelectric crystalline or amorphous piece(s), internally        and/or externally.    -   Staggered: the add-on material(s) attached, or internal, to the        thermoelectric pieces is/are staggered or in a discontinuous        pattern (FIG. 8).    -   Connectivity: the add-on electronic material(s) is/are extended        from the attachment on the thermoelectric piece to make thermal        connection with the heat transfer/electrical connectivity plates        and/or electrical connection. with adjacent similar or        dissimilar thermoelectric pieces/elements (FIG. 12).        In addition, use of the add-on materials allows for creative new        connection techniques such as incorporating integral snap-on,        snap-fit, slide on, spring like and/or adhesive bonded design        (5) to connect the thermoelectric element to adjacent        thermoelectric element(s) or to heat transfer/electrical        connectivity plate(s) of the thermoelectric device    -   External Encasement: the add-on electronic materials totally        encase the thermoelectric piece/element (FIG. 12 b).    -   Penetrations: the add-on electronic material(s) are attached to        the thermoelectric piece(s) and include have protrusion(s) or        wing(s) (8) and/or cutout(s) (9) that penetrate(s) the        thermoelectric piece(s)/element(s) for better electrical        conductivity (FIG. 9). A good example of this is to have several        U-shaped staple-like items made from add-on electronic        material(s) randomly attached and penetrate the thermoelectric        piece(s)/element(s).    -   Spiral Encasement: the add-on material(s) is/are spirally wound        around, or internal to, thermoelectric piece(s)/element(s).    -   Electrical windings: electrical wire is wrapped around, or        internal to, one or more thermoelectric piece(s) or        thermoelectric element(s).    -   Open-top Elements: present a new avenue for winding electrical        wire around the thermoelectric elements. The wire will assist        with rapid heat removal from the thermoelectric elements as well        as augment electrical output when subjected to magnetic field(s)        (FIG. 16). This design is also useful where the thermoelectric        device(s) are attached to surface(s) in motion and the rushing        air provides excellent cooling of the thermoelectric devices.    -   Height Difference: one or more of the multiple thermoelectric        pieces in each thermoelectric element having differing heights        (FIG. 13).    -   Connections: one or more of the multiple pieces in the        thermoelectric element is/are thermally and/or electrically        attached/connected by the add-on electronic material(s) to the        hot and/or cold heat transfer/electrical connectivity plate(s)        and/or to adjacent similar or dissimilar thermoelectric piece(s)        (FIG. 12 a).    -   Plate Topography: allows for more creative approaches to the        differing heights of thermoelectric pieces/elements with        modified height as well as reducing device footprint (FIG. 15).    -   Plate Perforations: addition of holes in the        heat-transfer/electrical connectivity plate allow the add-on        electronic material(s) to penetrate the plate and make direct        contact with the heat source to provide better heat transfer to        the thermoelectric element.    -   Thermal Conduction: of the add-on material(s) (7) also plays a        tremendous role in aiding the rapid movement of charges through        the thermoelectric element(s) (17).    -   Electrical Insulation: used to hold/separate thermoelectric        pieces apart (13).

Thermoelectric Segment (18)(FIGS. 18, 19 and 20):

-   -   Building Block: for construction of a thermoelectric device;        posts include specialty attachments (19)(21).    -   Heat Transfer/Electrical Connectivity Plate: specially designed        (23) to include several, or no, thermoelectric elements attached        to one or both sides of the face of plate. Optional bottom        plates may support the thermoelectric elements (22). Multiple        plate designs change the flow direction of the heat in the        thermoelectric device (FIG. 22).    -   Thermal Insulation: required between the hot and cold plates        (18).    -   Connections: The heat transfer/electrical connectivity plate        design incorporates integral snap-on, snap-fit, slide on, spring        like and/or adhesive bonded capability on the face plate(s) to        connect the thermoelectric element to adjacent thermoelectric        element(s) and or to the heat transfer/electrical connectivity        plate(s) of the thermoelectric device.    -   Ease of Manufacturability—multiple off-the-shelf thermoelectric        segments are readily are readily fitted together for in-time        manufacture of any size/power thermoelectric device.

New Multistage Devices (FIG. 22):

-   -   Multiple Segments: are connected together to form the multistage        device.    -   Footprint: is drastically reduced in comparison to current        equivalent devices with similar power output.    -   Multiple Plate Design: Posts are interconnected and attach to a        flat hot, or cold, plate.    -   Connections: as noted above for thermoelectric segments    -   Other Uses: attached to any surface, stationary or mobile.

Magnetic Fields:

Specially designed thermoelectric elements and/or thermoelectricsegments include the conductor part of the add-on electronic material(s)laid out in a specific layout, pattern and/or orientation such that thecharges in the add-on electronic materials are positively influenced bythe magnetic fields. Magnets are then strategically placed in, on orexternal to the thermoelectric device(s). The magnetic field(s) thenfurther excite the charges in the conductor materials of the add-onelectronic material(s) to further enhance flow of charges in thethermoelectric pieces and/or thermoelectric elements.

In addition, these specially designed thermoelectric elements could beplaced on a stationary or mobile surface to obtain maximum effect fromthe magnetic fields. One such example is to position these speciallydesigned thermoelectric segments on a multi-sided (hexagonal or similar)shaped drum with rotational bearings affixed at both ends of the drum;magnetic fields applied to the assembly will cause rotation of the drum.

Comparative Testing Performed on New Thermoelectric Device Designs:

Testing was performed on pairs of double half-sized thermoelectricelements with add-on electronic material(s) attached between thehalf-pieces and compared with pairs of pairs of full-sizedthermoelectric elements.

Per the design criteria discussed above the following work wasperformed:

-   -   each pair of thermoelectric elements was sandwiched between        alumina plates and electrical connections were made between the        thermoelectric elements specific to each thermoelectric element        pair/device    -   each thermoelectric device was placed on a test bench    -   heat was applied to the bottom alumina plate (1) of the        thermoelectric device    -   heat removal/cooling was applied to the top alumina plate (2) of        the thermoelectric device    -   extreme care was taken at all times to isolate the heat        application strictly to the bottom plate and the same for the        cooling at the top plate.

For each test performed on the devices fabricated, the following testcriteria were intentionally and strictly kept constant:

-   -   1) Electrical connections in device and circuitry    -   2) Temperature of heat input (1)    -   3) Heat removal/cooling (2)    -   4) Test circuit layout including resistor, wires, ammeter and        voltmeter    -   5) Alumina plates—size, thickness, material type    -   6) N-type material—initial size and from same material batch;        half-sized too    -   7) P-type material—initial size and from same material batch;        half-sized too    -   8) Time of test heat up and measurement of results

Testing: A resistive-type heater was applied to one side of one testdevice at a time and heat removal/cooling applied to the other side ofthe device. The voltage readings and current were recorded at 5-10minute intervals

Test results for each of the three batches differed slightly; however,it was found that for each batch the results were comparably the same,i.e., the new double half-size thermoelectric element pair designs withadd-on electronic material(s) produced results that were 75-90% higherthan those of the standard full-sized thermoelectric element pairdesigns.

It is anticipated that the proposed designs of this patent will beutilized with all thermoelectric materials and fluids, add-on electronicmaterials, standard or irregular thermoelectric element shapes and/ordesigns, element pairs, individual and multiple heat transfer/electricalconnectivity plate designs, shapes and connections, thermoelectricdevice designs and shapes, thermoelectric segment shapes and layouts,multi-stage thermoelectric designs, shapes and devices, magneticenhancement/effect of/on the add-on electronic material(s) included withthe thermoelectric element(s), fabrication processes, and methods ofmanufacture to produce the highest efficiency thermoelectric elements,thermoelectric element pairs, thermoelectric segments, thermoelectricconversion devices, and multi-stage thermoelectric devices and systemsfor economical, high conversion efficiency and emission free powergeneration and cooling.

Many widely different examples of this invention may be made withoutdeparting from the spirit and scope thereof, and it is to be understoodthat the invention is not limited to the specific examples thereofexcept as defined in the appended claims.

1. A heat conversion methodology to enhance the efficiency ofthermoelectric devices comprising hybrid thermoelectric elements thatinclude thermally and/or electrically conductive material(s) and/orthermally and/or electrically insulator material(s), hereinafterreferred to as “add-on electronic material(s)”, combined with anyregular or irregular shaped thermoelectric material(s) and standardand/or modified heat transfer/electrical connectivity plates with one ormore of the following design criteria where at least one thermoelectricelement of the thermoelectric device includes: one or more n-type, orp-type, thermoelectric piece(s) in the thermoelectric element one ormore add-on electronic material(s) is/are included in the thermoelectricelement one or more add-on electronic material(s) is/are combined and/orpositioned parallel to the flow of charges in the thermoelectricpiece(s) and/or thermoelectric element(s) one or more piece(s) ofn-type, or p-type, thermoelectric material that is/are fitted and/orcoated with a cap or sheath made from add-on hybrid material(s) thatpartially or wholly cover(s) one or more side(s) of each piece of thethermoelectric piece(s) and/or thermoelectric element(s) to enhance theflow of charges in the thermoelectric device(s) one or more of thecap(s) and/or sheath(s) made from add-on electronic material(s) used onone or more thermoelectric piece(s) and/or thermoelectric element(s)is/are also used as the thermally and/or electrically conductiveconnection to one or more of the heat transfer/electrical connectivityplates one or more of the cap(s) or sheath(s) made from add-onelectronic material(s) used on one or more thermoelectric piece(s)and/or thermoelectric element(s) is/are also used to electricallyconnect to one or more adjacent similar and/or dissimilar thermoelectricpiece(s) and/or adjacent similar and/or dissimilar thermoelectricelement(s) of the thermoelectric device one or more of n-type, orp-type, thermoelectric material(s) is/are partially or wholly attachedwith add-on electronic material(s) along a common side of thethermoelectric piece(s) of the thermoelectric element one or more of theadd-on electronic material(s) attached to, embedded in and/or encasingthe thermoelectric piece(s) and/or thermoelectric element(s) is/aredesigned to incorporate thermal and/or electrical conductiveconnection(s) to the heat transfer/electrical connectivity plates one ormore of the add-on electronic material(s) attached to, embedded inand/or encasing the thermoelectric piece(s) and/or thermoelectricelement(s) is/are designed to incorporate electrical connect(s) to oneor more adjacent similar and/or dissimilar thermoelectric piece(s)and/or adjacent similar and/or dissimilar thermoelectric element(s) inthe thermoelectric device one or more piece(s) of add-on electronicmaterial(s) is/are partially and/or wholly embedded in one or morethermoelectric piece(s) and/or thermoelectric element(s) one or morepiece(s) of add-on electronic material(s) which is/are partially and/orwholly attached to, embedded in, and/or encasing at least onethermoelectric piece of a thermoelectric element has at least a fractionof the add-on electronic material(s) positioned partially along theaxis(es) of flow of charges in the thermoelectric piece and/orthermoelectric element one or more n-type, or p-type, thermoelectricpiece(s) of a thermoelectric element which is/are partially and/orwholly encased in one or more add-on electronic material(s) one or moren-type, or p-type, thermoelectric material which is partially and/orwholly encased in one or more add-on electronic material(s) and thecasing is designed to make electrical and/or thermal connection(s) withthe heat transfer/electrical connectivity plates one or more n-type, orp-type, thermoelectric material which is partially and/or wholly encasedin one or more add-on electronic material(s) and the casing materialmakes electrical connection(s) to the adjacent similar and/or dissimilarthermoelectric piece(s) and/or similar and/or dissimilar thermoelectricelement(s) the add-on electronic material(s) are comprised of metal,non-metal, semiconductor, superconductor, ceramic, plastic, resin,adhesive or similar conductor and/or insulator material(s) and/orcombination(s) of the aforementioned material(s) the add-on electronicmaterial(s) is/are shaped similar or dissimilar to the face of thethermoelectric piece or thermoelectric element to which it is attached,embedded and/or encased the add-on electronic material(s) is/arecomprised one or more layers the add-on electronic material(s) is/arepartially or wholly wound around any axis of one or more thermoelectricpiece(s) or thermoelectric element(s) the add-on electronic material(s)is/are placed and/or attached, embedded in and/or encase one or morethermoelectric piece(s) and/or thermoelectric element(s) in adiscontinuous, separated, spaced apart and/or staggered method theadd-on electronic material(s) include a conductive or insulator surfacepreparation at partial and/or entire locations of the add-on electronicmaterial(s) to cause or prevent the thermoelectric material toelectrically adhere to the add-on electronic material to which it isattached, embedded in and/or encasing the thermoelectric piece(s) and/orthermoelectric element(s) to cause or prevent the charges flowing in thethermoelectric material to readily flow through the add-on electronicmaterial(s) at the locations with the conductive or insulator surfacepreparation the add-on electronic material(s) has/have one or morewing(s), lip(s) branch(es) or protrusion(s) of any shape that penetratethe thermoelectric material to which it is attached, embedded in and/orencasing the add-on electronic material(s) has/have one or more wing(s),branch(es) or protrusion(s) of any shape that are punched out from theadd-on electronic material(s) to protrude and penetrate thethermoelectric material to which it is attached, embedded in and/orencasing the add-on electronic material(s) has/have one or moreperforations and/or cutout(s) of any shape(s) in the add-on electronicmaterial(s) to allow the thermoelectric material(s) to penetrate throughthe add-on electronic material(s) to which it is attached, embedded inand/or encasing the add-on electronic material that is attached to,embedded in and/or encasing the thermoelectric piece(s) and/orthermoelectric element(s) is continuous tubular or cylindrical and ofcross-section that is circular, square, rectangular, elliptical and/orof similar or irregular shape(s) the add-on electronic material(s) thatis attached to, embedded in and/or encasing the thermoelectric piece(s)and/or thermoelectric element(s) is continuous or discontinuous theadd-on electronic material(s) that is attached to, embedded in and/orencasing the thermoelectric piece(s) and/or thermoelectric element(s) isof continuous or discontinuous helical coil shape one or more of then-type, or p-type, thermoelectric piece(s) in a thermoelectric elementin a thermoelectric device is/are of differing height(s) as measuredfrom hot to cold side of the thermoelectric piece one or more of then-type, or p-type, thermoelectric piece(s) in a thermoelectric elementin a thermoelectric device does not make contact with at least one heattransfer/electrical connectivity plate(s) add-on electronic material(s)that is/are attached to, embedded in, and/or encasing one or morethermoelectric pieces of n-type, or p-type, thermoelectric materialincorporate integral adhesive, slide fit, slide on, spring like, and/orsnap fit and/or other suitable interconnect attachment(s) add-onelectronic material(s) is/are used to electrically connect athermoelectric piece to adjacent thermoelectric piece(s), adjacentthermoelectric elements and/or to the heat transfer/electricalconnectivity plate(s) of the thermoelectric device add-on electronicmaterial(s) incorporating integral snap-on, snap-fit, slide on, springlike and/or adhesive bonded design to connect the thermoelectric elementto adjacent thermoelectric element(s) or to heat transfer/electricalconnectivity plate(s) of the thermoelectric device add-on electronicmaterial(s) with specially designed n-type, or p-type, metallic orconductor material(s) replace(s) one or more of the matching n-type, orp-type, thermoelectric piece(s) in the thermoelectric element pair(s)which drastically reduces the thermoelectric device footprint add-onelectronic material(s) with specially designed n-type, or p-type,metallic or conductor material(s) that replace(s) one or more of thematching n-type, or p-type, thermoelectric piece(s) in thethermoelectric element pair(s) as well as make(s) contact with the hotand/or cold side(s) of the heat transfer/electrical connectivityplate(s).
 2. The method of claim 1 wherein the thermoelectric device(s)include(s) at least one heat transfer/electrical connectivity plate thatinclude(s) one or more of the following: a topographic layout on theside(s) to which the thermoelectric piece(s) and/or thermoelectricelement(s) are soldered/attached, that is/are designed and suited toaccommodate thermoelectric piece(s) and/or thermoelectric element(s) ofdiffering heights one or more perforation(s) and/or cutout(s) to enhanceflow of heat to/from the thermoelectric piece(s) and/or thermoelectricelement(s) and thereby enhance performance of the thermoelectric devicethe add-on electronic material(s) of one or more of the thermoelectricpiece(s) and/or thermoelectric element(s) extends into one or more ofthe perforation(s) and/or cutout(s) to enhance flow of heat to/from thethermoelectric pieces and/or thermoelectric elements and thereby enhanceperformance of the thermoelectric device one or more heattransfer/electrical connectivity plate comprise(s) one or more piece(s)incorporates integral adhesive, slide fit, slide on, spring like, and/orsnap fit and/or other suitable interconnect attachment(s).
 3. The methodof claim 2 wherein a multistage thermoelectric device comprises one ormore prefabricated thermoelectric segments interconnected with suitableelectrical, thermal, fastening and/or insulator interconnects to satisfythe thermoelectric device design performance requirements wherein thethermoelectric segment(s) include(s): heat-transfer/electricalconnectivity plate(s) made from single or multiple piece design(s)heat-transfer/electrical connectivity plate(s) that has/have across-sectional shape of L, I, T, J, U, Z, O, C and/or similar shapeand/or combination of shapes one or more heat-transfer/electricalconnectivity plate(s) designed such that heat is introduced to the platein one direction and the plate design causes the heat flow to changedirection one or more times in the ceramic plate one or moreheat-transfer/electrical connectivity plate(s) incorporates integraladhesive, slide fit, slide on, spring like, snap fit and/or othersuitable interconnect attachment(s) on the flat side(s) of the plate aswell as on the end(s) one or more heat transfer/electrical connectivityplate(s) is/are designed for thermally and/or electrically attaching thethermoelectric piece(s) and/or thermoelectric element(s) to the uniquelydesigned thermoelectric segment(s) in the thermoelectric device one ormore of the thermoelectric segment(s) used in a thermoelectric devicehas/have a heat transfer/electrical connectivity plate with a differentdesign and/or different shape one or more of the thermoelectricsegment(s) used in a thermoelectric device includes single or multiplerows of n-type, or p-type, and/or alternating n-type and p-typethermoelectric piece(s) and/or thermoelectric element(s) attached to theheat transfer/electrical connectivity plate(s) one or more of thethermoelectric segment(s) used in a thermoelectric device is designedwith a differing layout and/or pattern including n-type, or p-typeand/or alternating n-type and p-type thermoelectric piece(s) and/orthermoelectric element(s) attached to the heat transfer/electricalconnectivity plate(s) one or more of the thermoelectric segments has nothermoelectric pieces and/or thermoelectric elements attached to theheat-transfer/electrical connectivity plate and has such that with itacts strictly as the heating, cooling and/or electrical connectionbetween the thermoelectric segments a heat-transfer/electricalconnectivity plate that has one or more n-type and/or p-typethermoelectric piece(s) and/or thermoelectric element(s) attached on oneside of the plates a heat-transfer/electrical connectivity plate havingone or more n-type and/or p-type thermoelectric piece(s) and/orthermoelectric element(s) attached on both sides of the plate a systemof cold or hot heat-transfer/electrical connectivity plate comprises aflat plate exposed to either hot or cold environment and multiple postsof any shape or design attached to the flat plate with thermoelectricpiece(s) and/or thermoelectric element(s) attached transverse to thepost(s)
 4. The method of claim 1 whereby the add-on electronicmaterial(s) is/are included in a mixed format, predetermined zone(s)and/or strip design layout in the mold for a hot-pressed or sinteredthermoelectric piece or thermoelectric element.
 5. The method of claim1, 2 or 3 whereby the thermoelectric elements are designed, positionedand laid out in the thermoelectric segment(s) and/or thermoelectricdevice(s) in a specific predetermined pattern such that the performanceof the thermoelectric device is positively enhanced when subjected toone or more magnetic field(s) by one or more magnetic source(s) thatis/are included and/or strategically positioned in, on, and/or externalto one or more thermoelectric device(s)
 6. The method of claim 3 wherebythe thermoelectric element(s), thermoelectric device(s), thermoelectricsegment(s) and/or multi-stage thermoelectric device(s) is/are designedto any shape and mounted at an angle relative to any axis of the heattransfer/electrical connectivity plate(s) of the thermoelectric device.7. The method of claim 3 whereby the thermoelectric element(s),thermoelectric device(s), thermoelectric segment(s) and/or multi-stagethermoelectric devices may be attached to any surface(s) that is/arestationary and/or in motion.
 8. The method of claim 3 whereby thethermoelectric element(s), thermoelectric device(s), thermoelectricsegments, and/or multi-stage thermoelectric devices may be individuallyattached to surface(s) that are stationary and/or in motion and theperformance/output of the aforementioned is/are positively enhanced whensubjected to one or more magnetic field(s) from one or more magneticsource(s) that is/are included and/or strategically positioned in, on,and/or external to one or more thermoelectric device(s) on the surfaceto which it is attached.
 9. The method of claim 1, 2 or 3 whereby thethermoelectric piece(s), thermoelectric element(s), thermoelectricsegments, and/or thermoelectric devices may be individually attached toa stationary object(s) of any shape and subjected to one or moremagnetic field(s) from one or more magnetic source(s) that is/areincluded and/or strategically positioned in, on, and/or external to oneor more thermoelectric device(s) and causes motion on the stationaryobject.
 10. The method of claim 1., 2., or
 3. wherein the thermoelectricpiece(s) and/or thermoelectric element(s), thermoelectric segment(s)and/or thermoelectric used in a thermoelectric device is/are fabricatedfrom any material and/or by any fabrication process or method.
 11. Themethod of claim 3 wherein each thermoelectric piece and/orthermoelectric element is placed at any angle relative to the mountingsurface of the heat transfer/electrical connectivity plate(s) of thethermoelectric device.
 12. The method of claim 1., 2., or 3 wherebyelectrical and/or thermal insulator support pedestals and spacers may beincluded where necessary.